Solder/adhesive bonding using simple planarization technique for 3D integration
- Masatsugu Nimura
- Jun Mizuno
- et al.
- 2011
- ECTC 2011
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3 results for Masatsugu Nimura
Low temperature Au-Au flip chip bonding with VUV/O 3 treatment for 3D integration
- Akiko Okada
- Masatsugu Nimura
- et al.
- 2012
- LTB-3D 2012
Hybrid au-adhesive bonding using planar adhesive structure for 3-D LSI
- Masatsugu Nimura
- Jun Mizuno
- et al.
- 2014
- IEEE Transactions on CPMT