A novel tri-layer nanoindentation method to measure the mechanical properties of a porous brittle ultra-low-k dielectric thin film
- Yingjie Du
- Tingge Xu
- et al.
- 2017
- Extreme Mechanics Letters
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71 results for Griselda Bonilla
CMOS compatible MIM decoupling capacitor with reliable sub-nm EOT high-k stacks for the 7 nm node and beyond
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- Eduard Cartier
- et al.
- 2016
- IEDM 2016
Electromigration: Void dynamics
- C. Witt
- V. Calero
- et al.
- 2016
- IEEE T-DMR
Creep characterization of solder bumps using nanoindentation
- Yingjie Du
- Xiao Hu Liu
- et al.
- 2016
- Mechanics of Time-Dependent Materials
Fundamental statistical properties of reconstruction methodology for TDDB with variability in BEOL/MOL/FEOL applications
- Ernest Y. Wu
- James Stathis
- et al.
- 2016
- IRPS 2016
Towards an appropriate acceleration model for beol tddb
- Ramachandran Muralidhar
- Eric G. Liniger
- et al.
- 2016
- IRPS 2016
The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps
- Thomas M. Shaw
- Xiao Hu Liu
- et al.
- 2016
- IRPS 2016
BEOL process integration for the 7 nm technology node
- T. Standaert
- Genevieve Beique
- et al.
- 2016
- IITC/AMC 2016
Post porosity plasma protection integration at 48 nm pitch
- H. Huang
- Krystelle Lionti
- et al.
- 2016
- IITC/AMC 2016
Interconnect performance and scaling strategy at the 5 nm Node
- James H.-C. Chen
- N.V. Licausi
- et al.
- 2016
- IITC/AMC 2016