Interconnect scaling challenges, and opportunities to enable system-level performance beyond 30 nm pitch
- Griselda Bonilla
- Nicholas A. Lanzillo
- et al.
- 2020
- IEDM 2020
Publications
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149 results for C. K. Hu
Mechanisms of Electromigration Damage in Cu Interconnects
- C. K. Hu
- Lynne Gignac
- et al.
- 2018
- IEDM 2018
Materials and scaling effects on on-chip interconnect reliability
- C.-K. Hu
- E. Liniger
- et al.
- 2013
- MRS Spring Meeting 2013
Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentals
- Takeshi Nogami
- C. Penny
- et al.
- 2012
- IEDM 2012
Cu CMP and its challenge for 20nm nodes and beyond
- John H. Zhang
- Wei-Tsu Tseng
- et al.
- 2012
- MRS Spring Meeting 2012
High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility
- Takeshi Nogami
- Tibor Bolom
- et al.
- 2010
- IEDM 2010
Electromigration reliability in nanoscale Cu interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- MRS Fall Meeting 2007
Thermal and electromigration-induced strains in copper conductor lines: X-ray microbeam measurements and analysis
- G. Wang
- H. Zhang
- et al.
- 2006
- MRS Spring Meeting 2006
Successful dual damascene integration of extreme low k materials (k < 2.0) using a novel gap fill based integration scheme
- S.V. Nitta
- S. Purushothaman
- et al.
- 2004
- IEDM 2004
Mechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999