Extendibility of Cu damascene to 0.1 μm wide interconnections
- C.-K. Hu
- K.Y. Lee
- et al.
- 1998
- MRS Spring Meeting 1998
Publications
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149 results for C. K. Hu
Reliability and copper interconnections with low dielectric constant materials
- C.-K. Hu
- 1998
- MRS Spring Meeting 1998
Mechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Local and global stress distributions in BEOL metallization
- I.C. Noyan
- E. Liniger
- et al.
- 1996
- MRS Spring Meeting 1996
Electromigration and diffusion in pure Cu and Cu(Sn) alloys
- C.-K. Hu
- K.L. Lee
- et al.
- 1996
- MRS Spring Meeting 1996
Electromigration and diffusion in pure Cu and Cu(Sn) alloys
- C.-K. Hu
- K.L. Lee
- et al.
- 1996
- MRS Spring Meeting 1996
Copper migration and precipitate dissolution in aluminum/copper lines during electromigration testing
- T.M. Shaw
- C.-K. Hu
- et al.
- 1996
- MRS Spring Meeting 1996
Manufacturability versus reliability issues relevant to interconnect metallizations
- K.P. Rodbell
- E.G. Colgan
- et al.
- 1994
- MRS Spring Meeting 1994
REACTIVE ION ETCHING OF Al(Cu) ALLOYS.
- C.-K. Hu
- M.B. Small
- et al.
- 1986
- MRS Fall Meeting 1986
Novel low k Dielectric materials for nano device interconnect technology
- Son Van Nguyen
- Hosadurga Shobha
- et al.
- 2020
- VLSI-TSA 2020