Line resistance and electromigration variations induced by hydrogen-based plasma modifications to the silicon carbonitride/copper interface
- E. Todd Ryan
- Jeremy Martin
- et al.
- 2007
- JES
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149 results for C. K. Hu
Impact of Cu microstructure on electromigration reliability
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- IITC 2007
Physical, electrical, and reliability characterization of Ru for Cu interconnects
- C.-C. Yang
- T. Spooner
- et al.
- 2006
- IITC 2006
Comparison of electromigration in Cu interconnects with ALD or PVD TaN liners
- C.-K. Hu
- L. Gignac
- et al.
- 2006
- ECS Meeting 2006
Electromigration Cu mass flow in Cu interconnections
- C.-K. Hu
- D. Canaperi
- et al.
- 2006
- Thin Solid Films
Thermal and electromigration-induced strains in copper conductor lines: X-ray microbeam measurements and analysis
- G. Wang
- H. Zhang
- et al.
- 2006
- MRS Spring Meeting 2006
Damascene copper integration impact on electomigration and stress migration
- Anthony K. Stamper
- H. Baks
- et al.
- 2005
- AMC 2005
Thermal and electromigration-induced strains in polycrystalline films and conductor lines: X-ray microbeam measurements and analysis
- G.S. Cargill III
- L.E. Moyer
- et al.
- 2005
- International Workshop on Stress-Induced Phenomena in Metallization 2005
Electromigration of Cu/low dielectric constant interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2006
- Microelectronics Reliability
Effect of metal liner on electromigration in Cu Damascene lines
- C.-K. Hu
- L. Gignac
- et al.
- 2005
- Journal of Applied Physics