Vertical-Transport Nanosheet Technology for CMOS Scaling beyond Lateral-Transport DevicesH. JagannathanB. Andersonet al.2021IEDM 2021
A holistic characterization methodology for stochastic printing failures in EUV contact holesJennifer ChurchBrad Austinet al.2021ASMC 2021
Missing Via Defect Capture Enhancement Using a Novel, High-Precision Array Segmentation Inspection TechniqueGraham JensenVidyasagar Ananthaet al.2021ASMC 2021
Gas cluster ion beam processing for improved self aligned contact yield at 7 nm node FinFET: MJ: MOL and junction interfacesSu Chen FanSean Teehanet al.2018ASMC 2018