Enhanced grain growth of electroplated copper on cobalt-containing seed layer
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2013
- JES
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48 results for E. Simonyi
Integration compatible porous SiCOH dielectrics from 45 to 22 nm
- S. Gates
- A. Grill
- et al.
- 2008
- ADMETA 2008
Effects of silylation on fracture and mechanical properties of mesoporous silica films interfaced with copper
- D.D. Gandhi
- B. Singh
- et al.
- 2009
- Journal of Applied Physics
Pore orientation and silylation effects on mesoporous silica film properties
- A.P. Singh
- D.D. Gandhi
- et al.
- 2009
- Applied Physics Letters
Low-k spacers for advanced low power CMOS devices with reduced parasitic capacitances
- Elbert Huang
- Eric Joseph
- et al.
- 2008
- IEEE International SOI Conference 2008
Chemical and mechanical properties of UV-cured nanoimprint resists and release layer interactions
- Frances A. Houle
- Ann Fornof
- et al.
- 2008
- SPIE Advanced Lithography 2008
Mechanical enhancement of low- k organosilicates by laser spike annealing
- Willi Volksen
- Geraud Dubois
- et al.
- 2008
- JES
Development and optimization of porous pSiCOH interconnect dielectrics for 45 nm and beyond
- A. Grill
- S. Gates
- et al.
- 2008
- IITC 2008
Glow discharge preparation of amorphous hydrogenated silicon from higher silanes
- B.A. Scott
- M.H. Brodsky
- et al.
- 2008
- Applied Physics Letters
Effects of environment on modulus of low-k porous films used in back end of line
- Eva E. Simonyi
- Christos D. Dimitrakopoulos
- et al.
- 2007
- MRS Spring Meeting 2007