Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
- D. Edelstein
- C.R. Davis
- et al.
- 2004
- IITC 2004
Publications
Date
Featured collections
Popular topics
48 results for E. Simonyi
Optimization of SiCOH dielectrics for integration in a 90 nm CMOS technology
- A. Grill
- D. Edelstein
- et al.
- 2004
- IITC 2004
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Analysis of an extreme low-κ organosilicate dielectric film exposed to representative plasmas and to a restorative process
- M. Colburn
- S.V. Nitta
- et al.
- 2003
- AMC 2003
Parameters associated with fabrication of an improved direct negative and plate: Methods and measurements
- K. Pennington
- E. Simonyi
- et al.
- 1989
- SPIE OE/LASE 1989
Improved materials for fabrication of direct negatives and plates by electro-erosion printing
- A. Afzali
- M. Desai
- et al.
- 1989
- SPIE OE/LASE 1989
Enhanced grain growth of electroplated copper on cobalt-containing seed layer
- Q. Huang
- B.C. Baker-O'Neal
- et al.
- 2013
- JES
Effects of silylation on fracture and mechanical properties of mesoporous silica films interfaced with copper
- D.D. Gandhi
- B. Singh
- et al.
- 2009
- Journal of Applied Physics
Pore orientation and silylation effects on mesoporous silica film properties
- A.P. Singh
- D.D. Gandhi
- et al.
- 2009
- Applied Physics Letters