Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates
- Katsuyuki Sakuma
- Edmund Blackshear
- et al.
- 2013
- ECTC 2013
Publications
Date
Featured collections
Popular topics
2 results for Edmund Blackshear
The evolution of build-up package technology and its design challenges
- Edmund D. Blackshear
- Moises Cases
- et al.
- 2005
- IBM J. Res. Dev