High-performance sub-0.25 μm CMOS technology with multiple thresholds and copper interconnects
- L. Su
- R. Schulz
- et al.
- 1998
- VLSI Technology 1998
Publications
Date
Featured collections
Popular topics
20 results for R.D. Goldblatt
Copper dual damascene wiring for sub-0.25 μm CMOS technology
- J. Heidenreich
- D. Edelstein
- et al.
- 1998
- IITC 1998
Characterization of water vapor plasma‐modified polyimide
- R.D. Goldblatt
- L. Ferreiro
- et al.
- 2003
- Journal of Applied Polymer Science
Surface composition of polystyrene
- Ronald D. Goldblatt
- Gerald J. Scilla
- et al.
- 2003
- Journal of Applied Polymer Science
Photochemical surface modification of poly(ethylene terephthalate)
- Ronald D. Goldblatt
- Jae M. Park
- et al.
- 2003
- Journal of Applied Polymer Science
A time-of-flight static secondary ion mass spectrometry and X-ray photoelectron spectroscopy study of 3-aminopropyltrihydroxysilane on water plasma treated chromium and silicon surfaces
- B.N. Eldridge
- L.P. Buchwalter
- et al.
- 1992
- Journal of Adhesion Science and Technology
An isotope approach to characterization of microwave water plasma modified polyimide surfaces
- N.J. Chou
- A.D. Marwick
- et al.
- 1992
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Ceramic Packages for Liquid-Nitrogen Operation
- Ho-Ming Tong
- Helen L. Yeh
- et al.
- 1989
- IEEE T-ED
Gold/fluorocarbon adhesion
- Jae M. Park
- R.D. Goldblatt
- et al.
- 1987
- Journal of Adhesion Science and Technology
Mechanism of microwave plasma etching of polyimides in O2 and CF4 gas mixtures
- N.J. Chou
- J. Parazsczak
- et al.
- 1986
- Microelectronic Engineering