Ultra-low-power 10 to 28.5 Gb/s CMOS-driven VCSEL-based optical links [Invited]
- Jonathan E. Proesel
- Benjamin G. Lee
- et al.
- 2012
- J. of Opt. Comm. and Netw.
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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176 results for Christian Baks
High-speed receiver based on waveguide germanium photodetector wire-bonded to 90nm SOI CMOS amplifier
- Huapu Pan
- Solomon Assefa
- et al.
- 2012
- Optics Express
25-Gb/s 6.5-pJ/bit 90-nm CMOS-driven multimode optical link
- Clint L. Schow
- Alexander V. Rylyakov
- et al.
- 2012
- IEEE Photonics Technology Letters
End-to-end multicore multimode fiber optic link operating up to 120 Gb/s
- Benjamin G. Lee
- Daniel M. Kuchta
- et al.
- 2012
- Journal of Lightwave Technology
Terabit/s-class optical PCB links incorporating 360-Gb/s bidirectional 850 nm parallel optical transceivers
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2012
- Journal of Lightwave Technology
Transmitter predistortion for simultaneous improvements in bit rate, sensitivity, jitter, and power efficiency in 20 Gb/s CMOS-Driven VCSEL links
- Alexander V. Rylyakov
- Clint L. Schow
- et al.
- 2012
- Journal of Lightwave Technology
Electrical performance of the recessed probe launch technique for measurement of embedded multilayer structures
- Miroslav Kotzev
- Renato Rimolo-Donadio
- et al.
- 2012
- IEEE Trans. Instrum. Meas.
A 24-channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single "holey" CMOS IC
- Clint L. Schow
- Fuad E. Doany
- et al.
- 2011
- Journal of Lightwave Technology
160 Gb/s bidirectional polymer-waveguide board-level optical interconnects using CMOS-cased transceivers
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2009
- IEEE Transactions on Advanced Packaging
Is 25 Gb/s on-board signaling viable?
- Dong G. Kam
- Mark B. Ritter
- et al.
- 2009
- IEEE Transactions on Advanced Packaging