Directed self-assembly process implementation in a 300mm pilot line environment
- Chi-Chun Liu
- I. Cristina Estrada-Raygoza
- et al.
- 2013
- SPIE Advanced Lithography 2013
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13 results for Yunpeng Yin
56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via
- James Hsueh-Chung Chen
- Christopher Waskiewicz
- et al.
- 2012
- IITC 2012
64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme
- Shyng-Tsong Chen
- Hideyuki Tomizawa
- et al.
- 2011
- IITC/MAM 2011
Optimization of pitch-split double patterning phoresist for applications at the 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2011
- ASMC 2011
Plasma etch challenges for porous low k materials for 32nm and beyond
- Catherine Labelle
- R. Srivastava
- et al.
- 2011
- CSTIC 2011
Spacer-defined double patterning for 20-nm and beyond logic BEOL technology
- Ryoung-Han Kim
- Chiew-Seng Koay
- et al.
- 2011
- SPIE Advanced Lithography 2011
Optimization of pitch-split double patterning photoresist for applications at the 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2011
- SPIE Advanced Lithography 2011
Systematic studies on reactive ion etch-induced deformations of organic underlayers
- Martin Glodde
- Sebastian Engelmann
- et al.
- 2011
- SPIE Advanced Lithography 2011
Fabrication of dual damascene BEOL structures using a multi-level multiple exposure (MLME) scheme - Part 2. RIE-based pattern transfer and completion of dual damascene process yielding an electrically functional via chain
- Stefan Harrer
- John C Arnold
- et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010
Process characterization of pitch-split resist materials for application at 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010