Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures
- F. Chen
- J. Gill
- et al.
- 2006
- Microelectronics Reliability
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15 results for T.D. Sullivan
The effect of current density, stripe length, stripe width, and temperature on resistance saturation during electromigration testing
- R. Filippi
- R.A. Wachnik
- et al.
- 2002
- Journal of Applied Physics
Electromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etching
- R. Filippi
- M. Gribelyuk
- et al.
- 2001
- Thin Solid Films
IBM experiments in soft fails in computer electronics (1978-1994)
- J.F. Ziegler
- H.W. Curtis
- et al.
- 1996
- IBM J. Res. Dev
Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
- C.-K. Hu
- K.P. Rodbell
- et al.
- 1995
- IBM J. Res. Dev