QALD-3: Multilingual question answering over linked data
Elena Cabrio, Philipp Cimiano, et al.
CLEF 2013
Physical phenomena underlying failure due to electromigration and stress-induced voiding in fine Al and Al-alloy thin-film conducting lines are examined in the context of accelerated testing methods and structures. Aspects examined include effects due to line isolation (the absence of reservoirs at conductor ends), solute and precipitate phenomena, conductor critical (Blech) length, microstructure, film deposition conditions, and thermal processing subsequent to film deposition. Emphasis is on the isolated, submicron-wide, Al(Cu)-based thin-film interconnection lines of IBM VLSI logic and memory chips.
Elena Cabrio, Philipp Cimiano, et al.
CLEF 2013
Yvonne Anne Pignolet, Stefan Schmid, et al.
Discrete Mathematics and Theoretical Computer Science
B.K. Boguraev, Mary S. Neff
HICSS 2000
N.K. Ratha, A.K. Jain, et al.
Workshop CAMP 2000