Improvements in profile control using ISPC™ system during the stop-in-oxide CMP step in the RMG process flow on IBM 20nm short-loop wafers
- P. Komarenko
- J. Qian
- et al.
- 2012
- ICPT 2012
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4 results for J. Salfelder
Cu CMP edge uniformity improvement studies for 32 nm technology node and beyond
- John H. Zhang
- Laertis Economikos
- et al.
- 2010
- MRS Online Proceedings Library
Electro-chemical mechanical planarization and its evaluation on BEOL with 65nm node dimensions
- A. Sakamoto
- L. Economikos
- et al.
- 2005
- CMP-MIC 2005
Integrated electro-chemical mechanical planarization (Ecmp) for future generation device technology
- L. Economikos
- X. Wang
- et al.
- 2004
- IITC 2004