3D copper TSV integration, testing and reliability
- Mukta Farooq
- T. Graves-Abe
- et al.
- 2011
- IEDM 2011
Publications
4 results for M.J. Shapiro
Three-dimensional chip stack with integrated decoupling capacitors and thru-si via interconnects
- Bing Dang
- Michael Shapiro
- et al.
- 2010
- IEEE Electron Device Letters
Reliable through silicon vias for 3D silicon applications
- M.J. Shapiro
- M. Interrante
- et al.
- 2009
- IITC 2009
CVD of fluorosilicate glass for ULSI applications
- M.J. Shapiro
- S. Nguyen
- et al.
- 1995
- Thin Solid Films