Low power passive equalizer optimization using tritonic step response
- Ling Zhang
- Wenjian Yu
- et al.
- 2008
- DAC 2008
Publications
Date
Featured collections
Popular topics
92 results for Alina Deutsch
Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
- J.D. Morsey
- L. Jiang
- et al.
- 2008
- ECTC 2008
Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- And multi-chip modules
- Sungjun Chun
- Anand Haridass
- et al.
- 2005
- ECTC 2005
Cellular supercomputing with system-on-a-chip
- G. Almasi
- G. Almasi
- et al.
- 2002
- ISSCC 2002
Functional high-speed characterization and modeling of a six-layer copper wiring structure and performance comparison with aluminum on-chip interconnections
- A. Deutsch
- H. Harrer
- et al.
- 1998
- IEDM 1998
When are transmission-line effects important for on-chip interconnections
- A. Deutsch
- G.V. Kopcsay
- et al.
- 1997
- ECTC 1997
Single-chip 4×500Mbaud CMOS transceiver
- A.X. Widmer
- K. Wrenner
- et al.
- 1996
- ISSCC 1996
Intra-system interconnects for digital communications
- A. Deutsch
- G. Arjavalingam
- et al.
- 1994
- ECTC 1994
Package analysis tool based on a method of moments/surface formulation
- Saila Ponnapalli
- R. Bertin
- et al.
- 1993
- ECTC 1993
Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- APEMC 2010