Stress gradients observed in Cu thin films induced by capping layers
- Conal E. Murray
- Paul R. Besser
- et al.
- 2009
- MRS Spring Meeting 2009
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15 results for Paul R. Besser
Extendibility of NiPt silicide contacts for CMOS technology demonstrated to the 22-nm node
- Kazuya Ohuchi
- Christian Lavoie
- et al.
- 2007
- IEDM 2007
Effects of BEOL stack on thermal mechanical stress of Cu lines
- Seung-Hyun Rhee
- Conal E. Murray
- et al.
- 2006
- MRS Spring Meeting 2006
Silicide challenges for 22nm technologies and beyond
- Paul R. Besser
- Christian Lavoie
- et al.
- 2008
- ECS Meeting 2008
Material and integration issues for rare-Earth Silicides as gate and diffusion contacts in advanced CMOS
- C. D'Emic
- K. Ohuchi
- et al.
- 2008
- ECS Meeting 2008
Extendibility of NiPt silicide to the 22-nm node CMOS technology
- Kazuya Ohuchi
- Christian Lavoie
- et al.
- 2008
- IWJT 2008
Implementation of robust nickel alloy salicide process for high-performance 65nm SOI CMOS manufacturing
- Jay Strane
- David Brown
- et al.
- 2007
- VLSI-TSA 2007
Understanding stress gradients in microelectronic metallization
- Conal E. Murray
- E. Todd Ryan
- et al.
- 2012
- Powder Diffraction
Evolution of stress gradients in Cu films and features induced by capping layers
- Conal E. Murray
- E.T. Ryan
- et al.
- 2012
- Microelectronic Engineering
Manipulating stress in Cu/low-k dielectric nanocomposites
- Conal E. Murray
- Paul R. Besser
- et al.
- 2011
- Applied Physics Letters