Texture in Ti/Al and Nb/Al multilayer thin films: Role of Cu
- G.A. Lucadamo
- Katayun Barmak
- et al.
- 2001
- Journal of Materials Research
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126 results for Ken Rodbell
The microstructure of submicrometer wide planar-reactive ion etched versus trench-damascene AlCu lines
- K.P. Rodbell
- L. Gignac
- et al.
- 2000
- Journal of Applied Physics
Probing capped and uncapped mesoporous low-dielectric constant films using positron annihilation lifetime spectroscopy
- Mihail P. Petkov
- Marc H. Weber
- et al.
- 2000
- Applied Physics Letters
Copper metallization for high performance silicon technology
- R. Rosenberg
- D. Edelstein
- et al.
- 2000
- Annual Review of Materials Science
Open volume defects (measured by positron annihilation spectroscopy) in thin film hydrogen-silsesquioxane spin-on-glass; correlation with dielectric constant
- Mihail P. Petkov
- Marc H. Weber
- et al.
- 1999
- Journal of Applied Physics
Doppler broadening positron annihilation spectroscopy: A technique for measuring open-volume defects in silsesquioxane spin-on glass films
- Mihail P. Petkov
- Marc H. Weer
- et al.
- 1999
- Applied Physics Letters
Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics
Linewidth and underlayer influence on texture in submicrometer-wide Al and AlCu lines
- J.L. Hurd
- K.P. Rodbell
- et al.
- 1998
- Applied Physics Letters
Control of in-plane texture of body centered cubic metal thin films
- J.M.E. Harper
- K.P. Rodbell
- et al.
- 1997
- Journal of Applied Physics
Electromigration behavior of hot-sputtered Al(Cu) versus chemical vapor deposition W vias
- R. Filippi
- E.N. Levine
- et al.
- 1997
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures