Technologies to further reduce soft error susceptibility in SOI
- P. Oldiges
- R.H. Dennard
- et al.
- 2009
- IEDM 2009
Publications
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126 results for Ken Rodbell
Improved electromigration lifetime for copper interconnects using tantalum implant
- Jeff Gambino
- Timothy D. Sullivan
- et al.
- 2007
- MRS Spring Meeting 2007
Characterization of thin dielectric films as copper diffusion barriers using triangular voltage sweep
- S. Cohen
- J.C. Liu
- et al.
- 1999
- MRS Spring Meeting 1999
Characterization of plated Cu thin film microstructures
- L. Gignac
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
Mechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
In-situ study of Ti/TiN stability under nitrogen anneal
- P. DeHaven
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
Mechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Characterization of plated Cu thin film microstructures
- L. Gignac
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
In-plane crystallographic texture of bcc metal thin films on amorphous substrates
- J.M.E. Harper
- K.P. Rodbell
- et al.
- 1997
- MRS Spring Meeting 1997
Blanket and local crystallographic texture determination in layered Al metallization
- K.P. Rodbell
- J.L. Hurd
- et al.
- 1995
- MRS Fall Meeting 1995