Direct integration of dense parallel optical interconnects on a first level package for high-end servers
- Evan G. Colgan
- Bruce Furman
- et al.
- 2005
- ECTC 2005
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7 results for John Torok
Analysis and evaluation methods associated with the application of compliant thermal interface materials in multi-chip electronic board assemblies
- John Torok
- Shawn Canfield
- et al.
- 2011
- SEM Annual Conference on Experimental and Applied Mechanics 2011
Using in situ capacitance measurements to monitor the stability of thermal interface materials in complex PCB assemblies
- Michael Gaynes
- Timothy Chainer
- et al.
- 2010
- IMAPS 2010
Novel packaging of parallel-optical interconnects for high-end servers
- Steven A. Rosenau
- Jonathan Simon
- et al.
- 2006
- OFC 2006
Novel packaging of parallel-optical interconnects for high-end servers
- Steven A. Rosenau
- Jonathan Simon
- et al.
- 2005
- OFC/NFOEC 2005
Novel packaging of parallel-optical interconnects for high-end servers
- Steven A. Rosenau
- Jonathan Simon
- et al.
- 2005
- OFC 2005
Packaging design of the IBM System z10 Enterprise Class platform central electronic complex
- John G. Torok
- Frank E. Bosco
- et al.
- 2009
- IBM J. Res. Dev