Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- IEDM 2005
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17 results for Keith Kwietniak
Pb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999
Electrodeposition for Hi-MEMS with special reference to fabrication of a magnetic mini-motor
- E.J.M. O'Sullivan
- E.I. Cooper
- et al.
- 1996
- MRS Fall Meeting 1996
Trench storage capacitors for high density DRAMs
- T.V. Rajeevakumar
- T. Lii
- et al.
- 1991
- IEDM 1991
Development and characterization of advanced process technologies for the fabrication of crystalline-Si solar cells
- Satyavolu S. Papa Rao
- Kate Fisher
- et al.
- 2010
- PVSC 2010
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ADMETA 2005
BEOL interconnects for 45 nm node and beyond
- R.R. Yu
- J. Doyle
- et al.
- 2005
- VMIC 2005
Assembly technology for three dimensional integrated circuits
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- VMIC 2005
Uniform copper electroplating on resistive substrates
- Rui Fang
- Keisuke Namiki
- et al.
- 2004
- ECS Meeting 2004
Sub-micron platinum electrodes by through-mask plating
- K.L. Saenger
- G. Costrini
- et al.
- 2000
- ECS Meeting 2000