Solder Mobility for High-Yield Self-Aligned Flip-Chip Assembly
- Yves Martin
- Swetha Kamlapurkar
- et al.
- 2017
- ECTC 2017
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103 results for Tymon Barwicz
Novel, High-Throughput, Fiber-to-Chip Assembly Employing only Off-the-Shelf Components
- Nicolas Boyer
- Alexander Janta-Polczynski
- et al.
- 2017
- ECTC 2017
High-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2017
- OFC 2017
A polymer waveguide material optimized for on-board optical links and Si photonic interfaces
- Shotaro Takenobu
- Kenta Kobayashi
- et al.
- 2017
- OFC 2017
Metamaterial waveguides with low distributed backscattering in production O-band Si photonics
- Bo Peng
- Chi Xiong
- et al.
- 2017
- OFC 2017
A silicon metamaterial chip-to-chip coupler for photonic flip-chip applications
- Tymon Barwicz
- Swetha Kamlapurkar
- et al.
- 2017
- OFC 2017
Reducing line edge roughness in si and sin through plasma etch chemistry optimization for photonic waveguide applications
- Nathan Marchack
- Marwan Khater
- et al.
- 2017
- SPIE Advanced Lithography 2017
Silicon photonics and challenges for fabrication
- N. Feilchenfeld
- Karen Nummy
- et al.
- 2017
- SPIE Advanced Lithography 2017
Distributed backscattering due to stochastic defects in production O-band Si photonic waveguides
- Bo Peng
- Jessie C. Rosenberg
- et al.
- 2016
- CLEO 2016
A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2016
- IEEE JSTQE