Electromigration in metals
- Paul S Ho
- Thomas Kwok
- 1999
- Reports on Progress in Physics
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118 results for Paul S. Ho
Characteristics of thermal stresses in Al(Cu) fine lines. II. Passivated line structures
- I.-S. Yeo
- S.G.H. Anderson
- et al.
- 1995
- Journal of Applied Physics
Electromigration in Al(Cu) two-level structures: Effect of Cu and kinetics of damage formation
- C.-K. Hu
- M.B. Small
- et al.
- 1993
- Journal of Applied Physics
Electromigration failure due to interfacial diffusion in fine Al alloy lines
- C.-K. Hu
- M.B. Small
- et al.
- 1993
- Applied Physics Letters
Measurement of thermal stress and stress relaxation in confined metal lines. I. Stresses during thermal cycling
- M.A. Moske
- P.S. Ho
- et al.
- 1993
- Journal of Applied Physics
Measurement of thermal stress and stress relaxation in confined metal lines. II. Stress relaxation study
- M.A. Moske
- P.S. Ho
- et al.
- 1993
- Journal of Applied Physics
Electromigration and stress reliability in multilevel interconnect metallization
- Paul S. Ho
- M.A. Moske
- et al.
- 1992
- SPIE Microelectronic Processing 1992
Chemistry and morphology of Cr/BPDA-PDA interface formation
- Steven G. Anderson
- Jihperng Leu
- et al.
- 1993
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Electromigration in two-level interconnect structures with Al alloy lines and W studs
- C.-K. Hu
- P.S. Ho
- et al.
- 1992
- Journal of Applied Physics
Simulated crystalline structures of aromatic polyimides
- Tze Wing Poon
- B. David Silverman
- et al.
- 1992
- Physical Review B