Copper interconnect: Fabrication and reliability
- C.-K. Hu
- J.M.E. Harper
- 1997
- VLSI-TSA 1997
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122 results for J.M.E. Harper
Silicide formation in Ti-Si and Co-Si reactions
- L. Clevenger
- Q.Z. Hong
- et al.
- 1993
- MRS Proceedings 1993
Preparation of low resistivity Cu-1 at. %Cr thin films by magnetron sputtering
- C. Cabral
- J.M.E. Harper
- et al.
- 1992
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Enhanced sputtering of one species in the processing of multielement thin films
- S. Berg
- C. Nender
- et al.
- 1992
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
MICROSTRUCTURE OF NIOBIUM FILMS ORIENTED BY NON-NORMAL INCIDENCE ION BOMBARDMENT DURING GROWTH.
- J.M.E. Harper
- D.A. Smith
- et al.
- 1985
- MRS Symposium 1985
ION BEAM TECHNIQUES FOR THE DEPOSITION OF CERAMIC THIN FILMS.
- J.M.E. Harper
- 1983
- Emergent Process Methods for High-Technology Ceramics 1983
Crystallographic texture of C54 titanium disilicide as a function of deep submicron structure geometry
- V. Svilan
- K.P. Rodbell
- et al.
- 1997
- Journal of Electronic Materials
Low Energy Ion Beam Etching
- J.M.E. Harper
- J.J. Cuomo
- et al.
- 2019
- JES
Higher nitrides of hafnium, zirconium, and titanium synthesized by dual ion beam deposition
- B.O. Johansson
- H.T.G. Hentzell
- et al.
- 2011
- Journal of Materials Research
250-Å linewidths with PMMA electron resist
- A.N. Broers
- J.M.E. Harper
- et al.
- 2008
- Applied Physics Letters