Challenges and solutions of FinFET integration in an SRAM cell and a logic circuit for 22 nm node and beyondH. KawasakiV.S. Baskeret al.2009IEDM 2009
Understanding amorphous states of phase-change memory using frenkel-poole modelY.H. ShihM.H. Leeet al.2009IEDM 2009
Reduction of random telegraph noise in high-κ / metal-gate stacks for 22 nm generation FETsN. TegaH. Mikiet al.2009IEDM 2009
Extremely thin SOI (ETSOI) CMOS with record low variability for low power system-on-chip applicationsK. ChengA. Khakifiroozet al.2009IEDM 2009
Fully depleted extremely thin SOI technology fabricated by a novel integration scheme featuring implant-free, zero-silicon-loss, and faceted raised source/drainK. ChengA. Khakifiroozet al.2009VLSI Technology 2009
Electrical and materials characterization of reactive and co-sputtered tantalum carbide metal electrodes for high-K gate applicationsL.F. EdgeT. Voet al.2009ECS Meeting 2009
22 nm technology compatible fully functional 0.1 μm 2 6T-sram cellB. HaranA. Kumaret al.2008IEDM 2008
Mechanisms of retention loss in Ge2Sb2Te 5-based phase-change memoryY.H. ShihJ.Y. Wuet al.2008IEDM 2008
On the dynamic resistance and reliability of phase change memoryB. RajendranM.H. Leeet al.2008VLSI Technology 2008
Patterning of N:Ge2Sb2Te5 films and the characterization of etch induced modification for non-volatile phase change memory applicationsE. JosephT.D. Happet al.2008VLSI-TSA 2008