Investigation and effects of wafer bow in 3D integration bonding schemes
- K.N. Chen
- Y. Zhu
- et al.
- 2010
- Journal of Electronic Materials
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Morphological stability and specific resistivity of sub-10 nm silicide films of Ni1-x Ptx on Si substrate
- Zhen Zhang
- Shi Li Zhang
- et al.
- 2010
- Applied Physics Letters
Properties of ultrathin platinum deposited by atomic layer deposition for nanoscale copper-metallization schemes
- Yu Zhu
- Kathleen A. Dunn
- et al.
- 2007
- Journal of Materials Research