Plating of Copper into Through-Holes and Vias
- Richard C. Alkire
- Lubomyr T. Romankiw
- 2019
- JES
Publications
509 results at JES
Interaction Between ti and SiO2
- C.-Y. Ting
- M. Wittmer
- et al.
- 2019
- JES
An XPS and TEM Study of Intrinsic Adhesion Between Polyimide and Cr Films
- N.J. Chou
- D.W. Dong
- et al.
- 2019
- JES
Factors Affecting the Molybdenum Line Slope by Reactive Ion Etching
- Yue Kuo
- 2019
- JES
Oxidation of Plasma-Deposited α-SixC1-x:H Films
- J.M. Eldridge
- J.O. Moore
- et al.
- 2019
- JES
Plasma Etching of Silicon in SF6: Experimental and Reactor Modeling Studies
- Yeong-Jyh Lii
- Jacob Jorné
- et al.
- 2019
- JES
Low Energy Proton Beam Lithography with a Thin Oxygen-Etch Barrier Layer
- H. Hiraoka
- 2019
- JES
Redeposition during Deep Trench Etching
- Jacob Jorne
- 2019
- JES
Reactive Ion Etching of GaAs in Chlorine and Resulting Surface Damage
- B.S. Lee
- H. Baratte
- 2019
- JES
Initiation of electroless copper plating using Pd+2/poly(acrylic acid) films
- Robert L. Jackson
- 2019
- JES