Electrical Properties of AI/Ti Contact Metallurgy for VLSI Applications
- C.-Y. Ting
- B.L. Crowder
- 2019
- JES
Publications
509 results at JES
Fundamental Study of Acid Copper Through-Hole Electroplating Process
- Edward K. Yung
- Lubomyr T. Romankiw
- 2019
- JES
Repassivation transients measured with thin film breaking electrodes
- G.S. Frankel
- B. Rush
- et al.
- 2019
- JES
Oxidation of Plasma-Deposited α-SixC1-x:H Films
- J.M. Eldridge
- J.O. Moore
- et al.
- 2019
- JES
Feature-Size Dependence of Etch Rate in Reactive Ion Etching
- Young H. Lee
- Zhen H. Zhou
- 2019
- JES
Interaction Between ti and SiO2
- C.-Y. Ting
- M. Wittmer
- et al.
- 2019
- JES
Electrodeposition of Nickel-Iron Alloys: 1. Effect of Agitation
- P.C. Andricacos
- C. Arana
- et al.
- 2019
- JES
Plating of Copper into Through-Holes and Vias
- Richard C. Alkire
- Lubomyr T. Romankiw
- 2019
- JES
Short Time Annealing of Coevaporated Tungsten Silicide Films
- T.O. Sedgwick
- F.M. d'Heurle
- et al.
- 2019
- JES
Calculation of Galvanic Currents and Potentials Using a p-Type Finite Element Method
- R.B. Morris
- 2019
- JES