A Three-Layer Resist System for Deep U.V. and RIEMicrolithography on Nonplanar Surfaces
- E. Bassous
- G. Pepper
- et al.
- 2019
- JES
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A Cyclic Voltammetric Study of Pd-Sn Colloidal Catalysts for Electroless Deposition
- Jean Horkans
- 2019
- JES
Comparison of Thermoluminescence and Phosphorescence between Electron-Excited and U.V.-Excited Zinc Silicate Phosphors
- Takeshi Takamori
- Derek B. Dove
- 2019
- JES
Short Time Annealing
- T.O. Sedgwick
- 2019
- JES
Ambient Gas Effects on the Reaction of Titanium with Silicon
- Subramanian S. lyer
- Chung-Yu Ting
- et al.
- 2019
- JES
Structural Effects on a Submicron Trench Process
- Daeje Chin
- Sang H. Dhong
- et al.
- 2019
- JES
EFFECT OF Cu ON THE KINETICS AND MICROSTRUCTURE OF Al3Ti FORMATION.
- M. Wittmer
- F. Le Goues
- et al.
- 2019
- JES
Electrochemical and Metallurgical Aspects of Laser-Enhanced Jet Plating of Gold
- M.H. Gelchinski
- L. Romankiw
- et al.
- 2019
- JES
Mechanisms of Electroless Metal Plating II. Formaldehyde Oxidation
- Perminder Bindra
- Judith Roldan
- 2019
- JES
Computer simulation of dendritic electrodeposition
- Micha Tomkiewicz
- 2019
- JES