50μm pitch Pb-free micro-bumps by C4NP technology
- Bing Dang
- Da-Yuan Shih
- et al.
- 2008
- ECTC 2008
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18 results at ECTC 2008
On-chip 3-D technology independent model for millimeter-wave transmission lines with bend in BiCMOS technologies
- Guoan Wang
- Hanyi Ding
- et al.
- 2008
- ECTC 2008
Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
- J.D. Morsey
- L. Jiang
- et al.
- 2008
- ECTC 2008
Characterization of stacked die using die-to-wafer integration for high yield and throughput
- K. Sakuma
- P. Andry
- et al.
- 2008
- ECTC 2008
The viability of 25 Gb/s on-board signalling
- Mark B. Ritter
- Petar Pepeljugoski
- et al.
- 2008
- ECTC 2008
Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- Minhua Lu
- Paul Lauro
- et al.
- 2008
- ECTC 2008
Underfill fracture toughness as a function of cooling rate
- Soojae Park
- Claudius Feger
- 2008
- ECTC 2008
Chip package interaction evaluation for a high performance 65nm and 45nm CMOS technology in a stacked die package with C4 and wirebond interconnections
- Christopher Muzzy
- David Danovitch
- et al.
- 2008
- ECTC 2008