Layout based Monte-Carlo simulation (LBMCS) for complex back end of line (BEOL) design rule studyDongbing ShaoLawrence Clevengeret al.2017IITC 2017
Resistivity of copper interconnects at 28 nm pitch and copper cross-sectional area below 100 nm2Adam PyzynaHsinyu Tsaiet al.2017IITC 2017