Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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13 results at IITC 2017

Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires
- - C. K. Hu‬
  - James Kelly
  - et al.
- 2017
- IITC 2017
Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
- - C. J. Penny
  - S. Gates
  - et al.
- 2017
- IITC 2017
Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
- - Takeshi Nogami
  - Raghuveer Patlolla
  - et al.
- 2017
- IITC 2017
Tri-layer nanoindentation for mechanical characterization of ultra-low-k dielectrics
- - Tingge Xu
  - Yingjie Du
  - et al.
- 2017
- IITC 2017
Segment removal strategy in SAQP for advanced BEOL application
- - James H.-C. Chen
  - Terry A. Spooner
  - et al.
- 2017
- IITC 2017
Middle of line RC performance study at the 7 nm node
- - Susan Su Chen Fan
  - James H.-C. Chen
  - et al.
- 2017
- IITC 2017
Planarity considerations in SADP for advanced BEOL patterning
- - James H.-C. Chen
  - Terry A. Spooner
  - et al.
- 2017
- IITC 2017
Impact of pattern collapse on future micro/nano fabrication
- - Xiao Hu Liu
- 2017
- IITC 2017
Layout based Monte-Carlo simulation (LBMCS) for complex back end of line (BEOL) design rule study
- - Dongbing Shao
  - Lawrence Clevenger
  - et al.
- 2017
- IITC 2017
Microstructure modulation for resistance reduction in copper interconnects
- - Chih-Chao Yang
  - Terry A. Spooner
  - et al.
- 2017
- IITC 2017