Self-heating characterization of FinFET SOI devices using 2D time resolved emission measurementsFranco StellariKeith A. Jenkinset al.2015IRPS 2015
Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliabilityMukta FarooqGiuseppe La Rosaet al.2015IRPS 2015
A critical analysis of sampling-based reconstruction methodology for dielectric breakdown systems (BEOL/MOL/FEOL)Ernest Y. WuJames Stathiset al.2015IRPS 2015
Oxygen vacancy traps in Hi-K/Metal gate technologies and their potential for embedded memory applicationsC. KothandaramanX. Chenet al.2015IRPS 2015