Energy efficiency and air quality considerations in airside economized data centersLevente J. KleinSergio A. Bermudezet al.2015InterPACK 2015
Benchmarking study on the thermal management landscape for 3D ICS: from back-side to volumetric heat removalThomas BrunschwilerArvind Sridharet al.2015InterPACK 2015
Thermal design of a hierarchical radially expanding cavity for two-Phase cooling of integrated circuitsArvind SridharChin Lee Onget al.2015InterPACK 2015