Effects of low CTE materials on thermal deformation of organic substrates in flip chip package application
- Hiroyuki Mori
- Sayuri Kohara
- et al.
- 2015
- InterPACK 2015
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13 results at InterPACK 2015
Embedded two-phase cooling of large 3D compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2015
- InterPACK 2015
Eulerian multiphase conjugate model for chip-embedded microchannel flow boiling
- Pritish R. Parida
- Hsin-Hua Tsuei
- et al.
- 2015
- InterPACK 2015
Integrate monolithic nanostructures in microchannels to enhance flow boiling heat transfer of HFE-7000
- Fanghao Yang
- Xiaochuan Li
- et al.
- 2015
- InterPACK 2015
Validation study for VOF simulations of boiling in a microchannel
- Catherine Gorle
- Hyoungsoon Lee
- et al.
- 2015
- InterPACK 2015
LID-integral cold plate topology integration, performance, and reliability
- Gerd Schlottig
- Marco De Fazio
- et al.
- 2015
- InterPACK 2015
Local measurements of flow boiling heat transfer on hot spots In 3D compatible radial microchannels
- Fanghao Yang
- Mark D. Schultz
- et al.
- 2015
- InterPACK 2015
Discrete control of air conditioning units in mission critical facilities
- Sergio A. Bermudez
- Hendrik Hamann
- et al.
- 2015
- InterPACK 2015
Reduced order modeling for chip-embedded micro-channel flow boiling
- 2015
- InterPACK 2015
Effect of relative humidity, Temperature and gaseous and particulate contaminations on information technology equipment reliability
- Prabjit Singh
- Levente J. Klein
- et al.
- 2015
- InterPACK 2015