Optical packaging of silicon photonic devices for external connection of parallel optical signals
- Yoichi Taira
- Hidetoshi Numata
- 2013
- ECTC 2013
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13 results at ECTC 2013
High-speed signaling performance of multilevel wiring on glass substrates for 2.5-D integrated circuit and optoelectronic integration
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2013
- ECTC 2013
No Clean Flux technology for large die flip chip packages
- Akihiro Horibe
- Kang-Wook Lee
- et al.
- 2013
- ECTC 2013