Investigation of novel solder patterns for power delivery and heat removal support
- Thomas Brunschwiler
- Yassir Madhour
- et al.
- 2013
- ECTC 2013
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13 results at ECTC 2013
Plastic deformation effect on Sn whisker growth in electroplated Sn and Sn-Ag solders
- Sung K. Kang
- Jaewon Chang
- et al.
- 2013
- ECTC 2013
High-speed signaling performance of multilevel wiring on glass substrates for 2.5-D integrated circuit and optoelectronic integration
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2013
- ECTC 2013