Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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13 results at ECTC 2013

Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates
- - Katsuyuki Sakuma
  - Edmund Blackshear
  - et al.
- 2013
- ECTC 2013
Thermally enhanced pre-applied underfills for 3D integration
- - Akihiro Horibe
  - Keishi Okamoto
  - et al.
- 2013
- ECTC 2013
NiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50μm pitch in 3D chip stacks
- - Bing Dang
  - Steven Wright
  - et al.
- 2013
- ECTC 2013
Realization of ultra-low power I/O
- - Lei Shan
  - Timothy Dickson
  - et al.
- 2013
- ECTC 2013
High-speed signaling performance of multilevel wiring on glass substrates for 2.5-D integrated circuit and optoelectronic integration
- - Xiaoxiong Gu
  - Renato Rimolo-Donadio
  - et al.
- 2013
- ECTC 2013
Optical packaging of silicon photonic devices for external connection of parallel optical signals
- - Yoichi Taira
  - Hidetoshi Numata
- 2013
- ECTC 2013
Enhanced multilayer organic packages with embedded phased-array antennas for 60-GHz wireless communications
- - Xiaoxiong Gu
  - Dong Gun Kam
  - et al.
- 2013
- ECTC 2013
No Clean Flux technology for large die flip chip packages
- - Akihiro Horibe
  - Kang-Wook Lee
  - et al.
- 2013
- ECTC 2013
Power delivery modeling for 3D systems with non-uniform TSV distribution
- - Huanyu He
  - Zheng Xu
  - et al.
- 2013
- ECTC 2013
Electrochemical reactions in solder mask of flip chip-plastic ball grid array package
- - Kang-Wook Lee
  - Stephane Barbeau
  - et al.
- 2013
- ECTC 2013