On-chip high performance slow wave transmission lines using 3D steps for compact millimeter wave applications
- Guoan Wang
- Wayne Woods
- et al.
- 2011
- ECTC 2011
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16 results at ECTC 2011
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- Katsuyuki Sakuma
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Terabit/sec-class board-level optical interconnects through polymer waveguides using 24-channel bidirectional transceiver modules
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2011
- ECTC 2011
Surface-tension-driven multi-chip self-alignment techniques for heterogeneous 3D integration
- Fengda Sun
- Yusuf Leblebici
- et al.
- 2011
- ECTC 2011
Low-profile 3D silicon-on-silicon multi-chip assembly
- Paul Andry
- Bing Dang
- et al.
- 2011
- ECTC 2011
High-bandwidth density optical I/O for high-speed logic chip on waveguide-integrated organic carrier
- Masao Tokunari
- Yutaka Tsukada
- et al.
- 2011
- ECTC 2011