CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- Bing Dang
- Paul Andry
- et al.
- 2010
- ECTC 2010
Publications
12 results at ECTC 2010
Layer misregistration in PCB and its effects on signal propagation
- Lei Shan
- Young Kwark
- et al.
- 2010
- ECTC 2010