Publications

12 results at ECTC 2010

IMC bonding for 3D interconnection
- - Katsuyuki Sakuma
  - Kuniaki Sueoka
  - et al.
- 2010
- ECTC 2010
Underfill acceleration factor based on thermal fatigue crack growth rate
- - Soojae Park
  - Claudius Feger
  - et al.
- 2010
- ECTC 2010
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- - Bing Dang
  - Paul Andry
  - et al.
- 2010
- ECTC 2010
Layer misregistration in PCB and its effects on signal propagation
- - Lei Shan
  - Young Kwark
  - et al.
- 2010
- ECTC 2010
Direct measurement of local stress in first-level flip-chip organic packages
- - Ijeoma Nnebe
  - Soojae Park
  - et al.
- 2010
- ECTC 2010
Efficient full-wave modeling of high density TSVs for 3D integration
- - Xiaoxiong Gu
  - Boping Wu
  - et al.
- 2010
- ECTC 2010
Dense 24 TX + 24 RX fiber-coupled optical module based on a holey CMOS transceiver IC
- - Fuad E. Doany
  - Clint L. Schow
  - et al.
- 2010
- ECTC 2010
Electrical characterization of 3D Through-Silicon-Vias
- - Fei Liu
  - Xiaoxiong Gu
  - et al.
- 2010
- ECTC 2010
Novel adhesive development for CMOS-compatible thin wafer handling
- - K. Tamura
  - K. Nakada
  - et al.
- 2010
- ECTC 2010
Methodology for predicting C4 non-wets during the chip attach process
- - Vijay D. Khanna
  - Sri M. Sri-Jayantha
- 2010
- ECTC 2010