An efficient hybrid finite-element analysis of multiple vias sharing the same anti-pad in an arbitrarily shaped parallel-plate pair
- Yao-Jiang Zhang
- Liehui Ren
- et al.
- 2015
- IEEE T-MTT
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Calibrations for millimeter-wave silicon transistor characterization
- Dylan F. Williams
- Phillip Corson
- et al.
- 2014
- IEEE T-MTT
A self-steering receiver array using jointly coupled oscillators and phased-locked loops
- Arpit K. Gupta
- James F. Buckwalter
- 2014
- IEEE T-MTT
Application of vias as functional elements in microwave coupling structures
- Andreas Hardock
- Renato Rimolo-Donadio
- et al.
- 2013
- IEEE T-MTT
Integrated self-healing for mm-wave power amplifiers
- Steven M. Bowers
- Kaushik Sengupta
- et al.
- 2013
- IEEE T-MTT
Intelligent bipolar control of MEMS capacitive switches
- Guanghai Ding
- David Molinero
- et al.
- 2013
- IEEE T-MTT
Calibration-kit design for millimeter-wave silicon integrated circuits
- Dylan F. Williams
- Phillip Corson
- et al.
- 2013
- IEEE T-MTT
Interpolation-based parameterized model order reduction of delayed systems
- Francesco Ferranti
- Michel Nakhla
- et al.
- 2012
- IEEE T-MTT
Inductance calculations for plane-pair area fills with vias in a power distribution network using a cavity model and partial inductances
- Jingook Kim
- Jun Fan
- et al.
- 2011
- IEEE T-MTT
Ultimate RF performance potential of carbon electronics
- Siyuranga O. Koswatta
- Alberto Valdes-Garcia
- et al.
- 2011
- IEEE T-MTT