PEEC modeling of dispersive and lossy dielectrics
- Giulio Antonini
- Albert E. Ruehli
- et al.
- 2008
- IEEE Transactions on Advanced Packaging
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32 results at IEEE Transactions on Advanced Packaging
Polymer-waveguide-based board-level optical interconnect technology for datacom applications
- Roger Dangel
- Christoph Berger
- et al.
- 2008
- IEEE Transactions on Advanced Packaging
A packaging solution for optically testing wire-bonded chips
- Alberto Tosi
- Franco Stellari
- et al.
- 2008
- IEEE Transactions on Advanced Packaging
Drainage-induced dry-out of thermal greases
- Ijeoma M. Nnebe
- Claudiu Feger
- 2008
- IEEE Transactions on Advanced Packaging
Full-wave solver for microstrip trace and through-hole via in layered media
- Chong-Jin Ong
- Boping Wu
- et al.
- 2008
- IEEE Transactions on Advanced Packaging
40-Gb/s package design using wire-bonded plastic ball grid array
- Dong Gun Kam
- Joungho Kim
- 2008
- IEEE Transactions on Advanced Packaging
Waveform relaxation techniques for simulation of coupled interconnects with frequency-dependent parameters
- Natalie Nakhla
- Albert E. Ruehli
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
Solving low-frequency EM-CKT problems using the PEEC method
- Dipanjan Gope
- Albert Ruehli
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
Prediction of losses caused by roughness of metallization in printed-circuit boards
- Alina Deutsch
- Christopher W. Surovic
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
The use of accelerated full-wave modeling to analyze power island coupling in a hyperBGA SCM
- Jason Morsey
- Alina Deutsch
- et al.
- 2007
- IEEE Transactions on Advanced Packaging