Drainage-induced dry-out of thermal greases
- Ijeoma M. Nnebe
- Claudiu Feger
- 2008
- IEEE Transactions on Advanced Packaging
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32 results at IEEE Transactions on Advanced Packaging
Full-wave solver for microstrip trace and through-hole via in layered media
- Chong-Jin Ong
- Boping Wu
- et al.
- 2008
- IEEE Transactions on Advanced Packaging
40-Gb/s package design using wire-bonded plastic ball grid array
- Dong Gun Kam
- Joungho Kim
- 2008
- IEEE Transactions on Advanced Packaging
The use of accelerated full-wave modeling to analyze power island coupling in a hyperBGA SCM
- Jason Morsey
- Alina Deutsch
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
Waveform relaxation techniques for simulation of coupled interconnects with frequency-dependent parameters
- Natalie Nakhla
- Albert E. Ruehli
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
Solving low-frequency EM-CKT problems using the PEEC method
- Dipanjan Gope
- Albert Ruehli
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
Prediction of losses caused by roughness of metallization in printed-circuit boards
- Alina Deutsch
- Christopher W. Surovic
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
Flip-chip-assembled air-suspended inductors
- Patrick J. Bell
- Nilds D. Hoivik
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
New methodology for combined simulation of delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks
- Alina Deutsch
- Howard H. Smith
- et al.
- 2006
- IEEE Transactions on Advanced Packaging
Simulation of coupled interconnects using waveform relaxation and transverse partitioning
- Natalie M. Nakhla
- Albert E. Ruehli
- et al.
- 2006
- IEEE Transactions on Advanced Packaging