Distortion minimization for packaging level interconnects
Haikun Zhu, Rui Shi, et al.
IEEE Topical Meeting EPEPS 2006
Presented here are results and recommendations for reducing coupling between adjacent power islands based on full-wave simulations of a HyperBGA SCM (single-chip module). These simulations highlight the use of IBM's internally developed accelerated full-wave solver based on the precorrected fast Fourier transform approach. Speedups of 100 × and memory reductions of 12 × are shown for real engineering problems, as compared to direct integral equation solutions. © 2007 IEEE.
Haikun Zhu, Rui Shi, et al.
IEEE Topical Meeting EPEPS 2006
Robert Bertin, Alina Deutsch
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
I.M. Abe Elfadel, Alina Deutsch, et al.
IEEE Transactions on Advanced Packaging
Nickolas J. Mazzeo, Ian L. Sanders, et al.
IEEE Transactions on Magnetics