Short-Pulse Propagation Technique for Characterizing Resistive Package Interconnections
- Alina Deutsch
- G. Arjavalingam
- et al.
- 1992
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
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18 results at IEEE Transactions on Components, Hybrids, and Manufacturing Technology
A Wafer Design Problem in Semiconductor Manufacturing for Reliable Customer Service
- Ramakrishna Akella
- Chacko T. Abraham
- 1990
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Placing Surface Mount Components Using Coarse/Fine Positioning and Vision
- Jan P. Baartman
- Andrew E. Brennemann
- et al.
- 1990
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Electrical Characteristics of a Superconducting High-Speed Computer Package
- H. Ansjörg Beha
- Norman Raver
- 1985
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Packaging Technology for Josephson Integrated Circuits
- Syamal K. Lahiri
- H. Randall Bickford
- et al.
- 1982
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
A Ceramic Capacitor Substrate for High Speed Switching VLSI Chips
- Christopher H. Bajorek
- Chung-Wen Ho
- et al.
- 1982
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Pluggable Connectors for Josephson Computers
- Syamal K. Lahiri
- Pieter Geldermans
- et al.
- 1982
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
A Multilayer Ceramic Multichip Module
- Albert J. Blodgett
- 1980
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology