A Package Analysis Tool Based on a Method of Moments Surface Formulation
- Robert Bertin
- Alina Deutsch
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
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18 results at IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Effects of Parylene Coating on the Thermal Fatigue Life of Solder Joints in Ceramic Packages
- Ho-Ming Tong
- Lawrence S. Mok
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Measurements and Modeling of Fiber Optic Connector Pluggability
- Oded Paz
- Howell B. Schwartz
- et al.
- 1992
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Repair of Circuits by Laser Seeding and Constriction Induced Plating
- Julian P. Partridge
- Brian Hussey
- et al.
- 1992
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Nanopore Foams of High Temperature Polymers
- Jeff W. Labadie
- James L. Hedrick
- et al.
- 1992
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Designs of Low Stress I/O Pin Attach Structures
- D.Y. Shih
- P. Palmateer
- et al.
- 1992
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Gold-to-Aluminum Bonding for TAB Applications
- Sung K. Kang
- 1992
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Polyamic Alkyl Esters: Versatile Polyimide Precursors for Improved Dielectric Coatings
- Willi Volksen
- Do Y. Yoon
- et al.
- 1992
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Packaging of High-Density Fiber/Laser Modules Using Passive Alignment Techniques
- Mitchell S. Cohen
- Michael F. Cina
- et al.
- 1992
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology