Formation of polyimide–Cu complexes: improvement of direct Cu-on-PI and PI-on-Cu adhesion
- K.-W. Lee
- G.F. Walker
- et al.
- 1995
- Journal of Adhesion Science and Technology
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Modification of polyimide surface morphology: relationship between modification depth and adhesion strength
- Kang-Wook Lee
- 1994
- Journal of Adhesion Science and Technology
The effect of residual stresses on adhesion measurements
- M.D. Thouless
- H.M. Jensen
- 1994
- Journal of Adhesion Science and Technology
A Surface Acoustic Wave Sensor Study of Polyimide Thin Film Surface Treatments — Effect on Water Uptake
- D.W. Galipeau
- P.R. Story
- et al.
- 1994
- Journal of Adhesion Science and Technology
Adhesion studies of polyimide films using a surface acoustic wave sensor
- D.W. Galipeau
- J.F. Vetelino
- et al.
- 1993
- Journal of Adhesion Science and Technology
Tantalum and chromium adhesion to polyimide. Part 1. BPDA-PDA surface imidization and modification
- L.P. Buchwalter
- Ravi F. Saraf
- 1993
- Journal of Adhesion Science and Technology
Tantalum and chromium adhesion to polyimide. Part 2. peel and locus of failure analyses
- L.P. Buchwalter
- 1993
- Journal of Adhesion Science and Technology
Comparison of finite element stress analysis results with peel strength at the copper-polyimide interface
- R.H. Lacombe
- L.P. Buchwalter
- et al.
- 1993
- Journal of Adhesion Science and Technology
An XPS investigation of the adsorption of aminosilanes onto metal substrates
- M.R. Horner
- F.J. Boerio
- et al.
- 1992
- Journal of Adhesion Science and Technology
The use of peel tests to examine the self adhesion of polyimide films
- H.R. Brown
- A.C.M. Yang
- 1992
- Journal of Adhesion Science and Technology