Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging
- Frank Libsch
- Steve Bedell
- et al.
- 2024
- ECTC 2024
Publications
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52 results for Chiplets
Effect of Micro-channel Cross-section and Coolant Pressure on Two-Phase Cooling
- 2024
- ITherm 2024
A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- Sari Zerey
- Junghyun Cho
- et al.
- 2024
- ECTC 2024
Reliable Direct Bonded Heterogeneous Integration ( DBHI) for AI Hardware
- Divya Taneja
- Katherine Pilger
- et al.
- 2024
- DPC 2024
Design of Analog-AI Hardware Accelerators for Transformer-based Language Models (Invited)
- Geoffrey Burr
- Sidney Tsai
- et al.
- 2023
- IEDM 2023
SyncTREE: Fast Timing Analysis for Integrated Circuit Design through a Physics-informed Tree-based Graph Neural Network
- Yuting Hu
- Jiajie Li
- et al.
- 2023
- NeurIPS 2023
Design of synchronous frequency dividers in 5-nm FinFET CMOS technology
- 2023
- Electronics Letters
Towards a Formally Verified Security Monitor for VM-based Confidential Computing
- Wojciech Ozga
- Guerney Hunt
- et al.
- 2023
- MICRO 2023
The impact of Al on contact resistance and its suitability in fine pitch interconnects
- Fee Li Lie
- Sathya Raghavan
- et al.
- 2023
- IMAPS 2023
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- Toyohiro Aoki
- Katsuyuki Sakuma
- et al.
- 2023
- ECTC 2023