AI chiplets in an open ecosystem: barriers and solution approaches
- Daniel Friedman
- 2024
- DAC 2024
Publications
56 results for Chiplets
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Alberto Valdes Garcia
- 2024
- IMS 2024
Reduced Physics Modeling of Two-Phase Flow through High-Density Cooling Structures
- Pritish Parida
- Shurong Tian
- et al.
- 2024
- ITherm 2024
Electromigration Kinetics of SAC/SnBiAg Hybrid Solder
- Minhua Lu
- Evan Colgan
- 2024
- ECTC 2024
A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- Sari Zerey
- Junghyun Cho
- et al.
- 2024
- ECTC 2024
Effect of Micro-channel Cross-section and Coolant Pressure on Two-Phase Cooling
- 2024
- ITherm 2024
Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging
- Frank Libsch
- Steve Bedell
- et al.
- 2024
- ECTC 2024
Reliable Direct Bonded Heterogeneous Integration ( DBHI) for AI Hardware
- Divya Taneja
- Katherine Pilger
- et al.
- 2024
- DPC 2024
Design of Analog-AI Hardware Accelerators for Transformer-based Language Models (Invited)
- Geoffrey Burr
- Sidney Tsai
- et al.
- 2023
- IEDM 2023
SyncTREE: Fast Timing Analysis for Integrated Circuit Design through a Physics-informed Tree-based Graph Neural Network
- Yuting Hu
- Jiajie Li
- et al.
- 2023
- NeurIPS 2023