In Situ Scanning Tunneling Microscopy of Copper Deposition with Benzotriazole
- Rolf H. Muller
- 2019
- JES
Publications
509 results at JES
Fundamental Study of Acid Copper Through-Hole Electroplating Process
- Edward K. Yung
- Lubomyr T. Romankiw
- 2019
- JES
Near-Surface Damage and Contamination after CF4/H2 Reactive Ion Etching of Si
- G.S. Oehrlein
- R.M. Tromp
- et al.
- 2019
- JES
The Effect of Cyanide on the Oxidation of Formaldehyde on Au, Cu, and Pd Electrodes
- Jean Horkans
- 2019
- JES
Reactive Ion Etching of PECVD n+ a-Si:H: Plasma Damage to PECVD Silicon Nitride Film and Application to Thin Film Transistor Preparation
- M.S. Crowder
- 2019
- JES
Computer simulation of boron transport in magnetic czochralski growth of silicon
- W.E. Langlois
- 2019
- JES
High temperature process limitation on TiSi2
- C.-Y. Ting
- F.M. d'Heurle
- et al.
- 2019
- JES
Epitaxial Growth and Selectivity of AlxGa1-xAs Using Novel Metalorganic Precursors
- M.S. Goorsky
- T.F. Kuech
- et al.
- 2019
- JES
Pit Growth in Nife Thin Films
- B.M. Rush
- J. Dukovic
- et al.
- 2019
- JES
Silicon Oxidation Studies: Silicon Orientation Effects on Thermal Oxidation
- E. Tierney
- 2019
- JES