Publications

509 results at JES

EFFECT OF Cu ON THE KINETICS AND MICROSTRUCTURE OF Al₃Ti FORMATION.
- - M. Wittmer
  - F. Le Goues
  - et al.
- 2019
- JES
Mechanisms of Electroless Metal Plating II. Formaldehyde Oxidation
- - Perminder Bindra
  - Judith Roldan
- 2019
- JES
Simulation of Leveling in Electrodeposition
- - John O. Dukovic
  - Charles W. Tobias
- 2019
- JES
Repassivation transients measured with thin film breaking electrodes
- - G.S. Frankel
  - B. Rush
  - et al.
- 2019
- JES
Reactive Ion Etching of PECVD n⁺ a-Si:H: Plasma Damage to PECVD Silicon Nitride Film and Application to Thin Film Transistor Preparation
- - M.S. Crowder
- 2019
- JES
Dependence of the Flatband Voltage of Si-MOS on Distribution of Cesium in SiO₂ Comparison of Two Implantation Methods
- - L. Krusin-Elbaum
- 2019
- JES
Pd+2/poly(acrylic acid) thin films as catalysts for electroless copper deposition: Mechanism of catalyst formation
- - Robert L. Jackson
- 2019
- JES
Oxygen Exchange on Platinum Electrodes in Zirconia Cells: Location of Electrochemical Reaction Sites
- - James N. Michaels
  - Neil L. Robertson
- 2019
- JES
Plating of Copper into Through-Holes and Vias
- - Richard C. Alkire
  - Lubomyr T. Romankiw
- 2019
- JES
Laser-Enhanced Electrodeposition of Lead-Tin Solder
- - M. Datta
  - L.T. Romankiw
- 2019
- JES