Correlation between environmental and electrochemical corrosion of thin film magnetic recording media
- V. Novotny
- N. Staud
- 2019
- JES
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Initiation of electroless copper plating using Pd+2/poly(acrylic acid) films
- Robert L. Jackson
- 2019
- JES
Migration Considerations in Chronopotentiometric Analysis
- Huk Y. Cheh
- 2019
- JES
A Sensitive, Etch Resistant, Positive Tone E-Beam Resist System
- Hiroshi Ito
- L.A. Pederson
- et al.
- 2019
- JES
Simulation of Leveling in Electrodeposition
- John O. Dukovic
- Charles W. Tobias
- 2019
- JES
PtSi-Induced Junction Leakage
- J.P. Gambino
- M.D. Monkowski
- et al.
- 2019
- JES
Surface Modifications of Electronic Materials Induced by Plasma Etching
- G.S. Oehrlein
- S.W. Robey
- et al.
- 2019
- JES
Thermally Developable, Positive Resist Systems with High Sensitivity
- Hiroshi Ito
- Reinhold Schwalm
- 2019
- JES
Hexachlorodisilane as a Precursor in the LPCVD of Silicon Dioxide and Silicon Oxynitride Films
- R.C. Taylor
- B.A. Scott
- 2019
- JES
Electro-Oxidation of Formaldehyde on Thermally Prepared RuO2 and Other Noble Metal Oxides
- Eugene J. M. O'Sullivan
- James R. White
- 2019
- JES