Impedance spectroscopy studies of moisture uptake in low-k dielectrics and its relation to reliability
- A. Raja
- Robert B. Laibowitz
- et al.
- 2015
- Microelectronic Engineering
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221 results at Microelectronic Engineering
Electrical characterisation of InGaAs on insulator structures
- K. Cherkaoui
- Y.Y. Gomeniuk
- et al.
- 2015
- Microelectronic Engineering
Capillary assembly of cross-gradient particle arrays using a microfluidic chip
- Songbo Ni
- Mona J.K. Klein
- et al.
- 2015
- Microelectronic Engineering
An overview of through-silicon-via technology and manufacturing challenges
- Jeffrey P. Gambino
- Shawn A. Adderly
- et al.
- 2015
- Microelectronic Engineering
Resistless nanofabrication by stencil lithography: A review
- O. Vazquez-Mena
- Leo Gross
- et al.
- 2015
- Microelectronic Engineering
Lab-on-a-chip devices: How to close and plug the lab?
- Yuksel Temiz
- Robert D. Lovchik
- et al.
- 2015
- Microelectronic Engineering
Challenges of nickel silicidation in CMOS technologies
- Nicolas Breil
- Christian Lavoie
- et al.
- 2015
- Microelectronic Engineering
Dependence of Cu electromigration resistance on selectively deposited CVD Co cap thickness
- C.-C. Yang
- F. Baumann
- et al.
- 2013
- Microelectronic Engineering
Effective Cu surface pre-treatment for high-reliable 22 nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k = 2.2)
- F. Ito
- H. Shobha
- et al.
- 2012
- Microelectronic Engineering
Low resistivity tungsten for 32 nm node MOL contacts and beyond
- Filippos Papadatos
- Keith Wong
- et al.
- 2012
- Microelectronic Engineering